Van der Waals (vdW) metal electrodes have been demonstrated as a promising approach to reduce the contact resistance and minimize the Fermi level pinning effect at two-dimensional materials. However, only a limited number of metals can be mechanically peeled off from a sacrificed substrate. In this work, we demonstrate a universal electrode pick-up technology for contacting two-dimensional (2D) semiconductors assisted with the low energy hydrogenated diamond surface. With this technique, various metals have been tested, including Pt, Pd, Au, Ni, Cr, Ti, Al and Bi. Three of them (Pd, Ti, Bi) have been vdW integrated as the contact of monolayer TMD transistors.
About the presenter
Kaijian Xing is an FLEET Affiliate undertaking a PhD at Monash University with CI Michael Fuhrer.